Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Cut Tape (CT)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HEF4094BP,652
|
NXP | 功能相似 | DIP-16 |
Shift Register/Latch Single 8Bit Serial to Serial/Parallel 16Pin PDIP Bulk
|
||
HEF4094BT
|
Nexperia | 功能相似 | SOIC |
NXP HEF4094BT 移位寄存器, 1元件, SOIC, 16 引脚, 4.5 V, 15.5 V
|
||
HEF4094BTS,118
|
Nexperia | 功能相似 | SSOP-16 |
Shift Register/Latch Single 8Bit Serial to Serial/Parallel 16Pin SSOP T/R
|
||
HEF4094BTS,118
|
NXP | 功能相似 | SSOP-16 |
Shift Register/Latch Single 8Bit Serial to Serial/Parallel 16Pin SSOP T/R
|
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