Technical parameters/power supply current: 1.5 mA
Technical parameters/number of circuits: 2
Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP-16
External dimensions/packaging: DIP-16
Physical parameters/operating temperature: 0℃ ~ 75℃ (TA)
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DG508ADJ+
|
Maxim Integrated | 功能相似 | DIP-16 |
MAXIM INTEGRATED PRODUCTS DG508ADJ+ 芯片, 模拟多路复用器, 单路, 8:1, DIP-16
|
||
DG509ACJ+
|
Maxim Integrated | 功能相似 | DIP-16 |
MAXIM INTEGRATED PRODUCTS DG509ACJ+ 芯片, 模拟多路复用器, 双路, 4:1, DIP-16
|
||
HI3-0509A-5Z
|
Intersil | 类似代替 | DIP-16 |
INTERSIL HI3-0509A-5Z 芯片, 多路复用器, CMOS
|
||
HI3-0509A-5Z
|
Renesas Electronics | 类似代替 | DIP-16 |
INTERSIL HI3-0509A-5Z 芯片, 多路复用器, CMOS
|
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