Technical parameters/power supply voltage: 1.14V ~ 2.625V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TFBGA-325
External dimensions/packaging: TFBGA-325
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards:
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M2GL060TS-1FCS325I
|
Microsemi | 类似代替 | TFBGA-325 |
Ic Fpga 200 i/o 325fcbga
|
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