Technical parameters/RAM size: 64 KB
Technical parameters/FLASH memory capacity: 256 KB
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 400
Encapsulation parameters/Encapsulation: BGA-400
External dimensions/packaging: BGA-400
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M2S010T-VF400
|
Microsemi | 类似代替 | VFPBGA-400 |
FPGA - 现场可编程门阵列 SmartFusion2
|
||
M2S010T-VF400
|
SOC | 类似代替 | LFBGA-400 |
FPGA - 现场可编程门阵列 SmartFusion2
|
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