Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.14V ~ 2.625V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 676
Encapsulation parameters/Encapsulation: BGA-676
External dimensions/packaging: BGA-676
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M2GL060T-FG676
|
Microsemi | 完全替代 | BGA-676 |
Ic Fpga 387 i/o 676fbga
|
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