Technical parameters/RAM size: 64 KB
Technical parameters/FLASH memory capacity: 256 KB
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA-484
External dimensions/packaging: BGA-484
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M2S060T-1FG484I
|
Microsemi | 完全替代 | BGA-484 |
FPGA - 现场可编程门阵列 SmartFusion2
|
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