Technical parameters/RAM size: 64 KB
Technical parameters/FLASH memory capacity: 512 KB
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TFBGA-325
External dimensions/packaging: TFBGA-325
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M2S090TS-1FCS325
|
Microsemi | 类似代替 | TFBGA-325 |
其他系列 166MHz 512KB 64KB
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review