Technical parameters/RAM size: 64 KB
Technical parameters/FLASH memory capacity: 512 KB
Technical parameters/operating temperature (Max): 100 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 325
Encapsulation parameters/Encapsulation: FCBGA-325
External dimensions/packaging: FCBGA-325
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M2S090TS-FCS325I
|
Microsemi | 完全替代 | FCBGA-325 |
ARM Cortex-M3 166MHz 闪存:512KB RAM:64KB
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review