Encapsulation parameters/installation method: Through Hole
Physical parameters/medium materials: Tantalum
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
KEMET Corporation | 完全替代 |
10uF ±10% 35V Φ4.7mm 12.04mm
|
|||
M39003/03-0366
|
KEMET Corporation | 功能相似 | Axial |
10uF ±10% 35V Φ4.70mm 15.49mm
|
||
M39003/03-2066
|
KEMET Corporation | 功能相似 | Axial |
10uF ±10% 35V Φ4.70mm 15.49mm
|
||
|
|
Vishay Semiconductor | 功能相似 |
10uF ±10% 35V Φ4.70mm 15.49mm
|
|||
M39003/03-2066
|
VISHAY | 功能相似 |
10uF ±10% 35V Φ4.70mm 15.49mm
|
|||
M39003/03-2066
|
Vishay Sprague | 功能相似 |
10uF ±10% 35V Φ4.70mm 15.49mm
|
|||
|
|
Vishay Sprague | 功能相似 | Through Hole |
10uF ±10% 35V Φ7.34mm 17.42mm
|
||
|
|
KEMET Corporation | 功能相似 |
10uF ±10% 35V Φ7.34mm 17.42mm
|
|||
M39003/03-3066
|
Vishay Semiconductor | 功能相似 |
10uF ±10% 35V Φ7.34mm 17.42mm
|
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