Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSOP-40
External dimensions/packaging: TSOP-40
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M50FW080N5
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ST Microelectronics | 功能相似 | TSOP1 |
8兆位1Mb的X8 ,统一座3V供应固件集线器闪存 8 Mbit 1Mb x8, Uniform Block 3V Supply Firmware Hub Flash Memory
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ST Microelectronics | 功能相似 | TSOP1 |
8兆位1Mb的X8 ,统一座3V供应固件集线器闪存 8 Mbit 1Mb x8, Uniform Block 3V Supply Firmware Hub Flash Memory
|
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