Technical parameters/Contact electroplating: Tin
Physical parameters/contact material: Copper
Physical parameters/insulation material: Vinyl
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
RVES2-4
|
Multicomp | 类似代替 |
MULTICOMP RVES2-4 环形舌片端子, RVES系列, 8, M4, 14 AWG, 2 mm², 乙烯基
|
|||
SVES1-3.7
|
Multicomp | 类似代替 |
MULTICOMP SVES1-3.7 叉/铲形端子, SVES系列, 0.146 ", 22 AWG, 16 AWG, 1.5 mm²
|
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