Technical parameters/power supply voltage (DC): 3.30 V
Technical parameters/halogen-free state: Halogen Free
Technical parameters/dissipated power: 735 mW
Technical parameters/kernel architecture: PowerPC
Technical parameters/operating temperature (Max): 95 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/dissipated power (Max): 735 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 357
Encapsulation parameters/Encapsulation: BGA-357
External dimensions/packaging: BGA-357
Physical parameters/operating temperature: 0℃ ~ 95℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MPC855TVR50D4
|
NXP | 类似代替 | BGA-357 |
NXP MPC855TVR50D4. 芯片, 嵌入式网络处理器
|
||
MPC855TVR50D4
|
Freescale | 类似代替 | BBGA-357 |
NXP MPC855TVR50D4. 芯片, 嵌入式网络处理器
|
||
MPC855TVR50D4
|
NXP | 类似代替 | BGA-357 |
NXP MPC855TVR50D4. 芯片, 嵌入式网络处理器
|
||
MPC855TZQ50D4
|
NXP | 类似代替 | BGA-357 |
NXP MPC855TZQ50D4 芯片, 微处理器, 32位, 50MHZ, BGA-357
|
||
MPC855TZQ50D4
|
Freescale | 类似代替 | BGA-357 |
NXP MPC855TZQ50D4 芯片, 微处理器, 32位, 50MHZ, BGA-357
|
||
MPC860TVR50D4
|
Freescale | 类似代替 | BGA-357 |
微处理器 - MPU POWER QUICC-NO LEAD
|
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