Technical parameters/power supply voltage (DC): 1.80 V
Technical parameters/halogen-free state: Halogen Free
Technical parameters/dissipated power: 250 mW
Technical parameters/kernel architecture: PowerPC
Technical parameters/operating temperature (Max): 100 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 250 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 357
Encapsulation parameters/Encapsulation: PBGA-357
External dimensions/packaging: PBGA-357
Physical parameters/operating temperature: -40℃ ~ 100℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MPC859TCZP100A
|
NXP | 完全替代 | BGA-357 |
MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.18um 100MHz 3.3V 357Pin BGA Tray
|
||
|
|
Motorola | 完全替代 | 357 |
MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.18um 100MHz 3.3V 357Pin BGA Tray
|
||
MPC859TCZP100A
|
Freescale | 完全替代 | PBGA-357 |
MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.18um 100MHz 3.3V 357Pin BGA Tray
|
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