Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Diodes | 功能相似 | TSSOP-28 |
Clock Fanout Buffer 4Out 28Pin Tray
|
||
PI6CDBL402BLIE
|
Pericom Semiconductor | 功能相似 | TSSOP-28 |
Clock Fanout Buffer 4Out 28Pin Tray
|
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