Technical parameters/RAM size: 256 b
Technical parameters/dissipated power (Max): 800 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: QFN
External dimensions/packaging: QFN
Physical parameters/operating temperature: -40℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PIC16F1828-I/P
|
Microchip | 完全替代 | DIP-20 |
MICROCHIP PIC16F1828-I/P 微控制器, 8位, 闪存, AEC-Q100, PIC16F18xx, 32 MHz, 7 KB, 256 Byte, 20 引脚, DIP
|
||
PIC16F1828-I/SS
|
Microchip | 完全替代 | SSOP-20 |
MICROCHIP PIC16F1828-I/SS 微控制器, 8位, 闪存, AEC-Q100, PIC16F18xx, 32 MHz, 7 KB, 256 Byte, 20 引脚, SSOP
|
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