Technical parameters/RAM size: 64K x 8
Technical parameters/digits: 32
Technical parameters/number of ART: 6
Technical parameters/Analog to Digital Conversion (ADC): 1
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 121
Encapsulation parameters/Encapsulation: TFBGA-121
External dimensions/length: 10 mm
External dimensions/width: 10 mm
External dimensions/height: 0.6 mm
External dimensions/packaging: TFBGA-121
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PIC32MX675F256L-80I/BG
|
Microchip | 功能相似 | BGA-121 |
RISC 80MHz 闪存:256K@x8bit
|
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