Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: TO-66
External dimensions/packaging: TO-66
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Bulk
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PIC602
|
Microsemi | 功能相似 | TO-66 |
半导体器件,硅混合型开关稳压器高可靠性类型 Semiconductor Devices, Silicon hybrid Switching Regulators High Reliability Types
|
||
|
|
Microsemi | 功能相似 | TO-66 |
半导体器件,硅混合型开关稳压器高可靠性类型 Semiconductor Devices, Silicon hybrid Switching Regulators High Reliability Types
|
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