Technical parameters/forward voltage: 390mV @500mA
Technical parameters/thermal resistance: 90℃/W (RθJL)
Technical parameters/forward voltage (Max): 390mV @500mA
Technical parameters/forward current (Max): 0.5 A
Technical parameters/operating temperature (Max): 150 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/operating temperature: 140℃ (Max)
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: SOD-323
External dimensions/packaging: SOD-323
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PMEG2005AEA,115
|
NXP | 类似代替 | SOD-323 |
200mA 至 500mA,NXP Semiconductors 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流 ### 二极管和整流器,NXP Semiconductors NXP 以不同封装和配置提供广泛的开关二极管。
|
||
PMEG2005AEA,115
|
Nexperia | 类似代替 | SOD-323 |
200mA 至 500mA,NXP Semiconductors 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流 ### 二极管和整流器,NXP Semiconductors NXP 以不同封装和配置提供广泛的开关二极管。
|
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