Technical parameters/number of pins: 3
Technical parameters/forward voltage: 390mV @500mA
Technical parameters/dissipated power: 420 mW
Technical parameters/thermal resistance: 440℃/W (RθJA)
Technical parameters/forward current: 500 mA
Technical parameters/Maximum forward surge current (Ifsm): 10 A
Technical parameters/forward voltage (Max): 390mV @500mA
Technical parameters/forward current (Max): 500 mA
Technical parameters/operating temperature (Max): 150 ℃
Technical parameters/operating temperature (Min): -65 ℃
Technical parameters/operating temperature: 150℃ (Max)
Technical parameters/dissipated power (Max): 420 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: SOT-23-3
External dimensions/length: 3 mm
External dimensions/width: 1.4 mm
External dimensions/height: 1 mm
External dimensions/packaging: SOT-23-3
Physical parameters/operating temperature: 65℃ ~ 150℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: industry
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PMEG2005ET
|
NXP | 功能相似 | SOT-23 |
200mA 至 500mA，NXP Semiconductors 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流 ### 二极管和整流器，NXP Semiconductors NXP 以不同封装和配置提供广泛的开关二极管。
|
||
PMEG2005ET
|
Nexperia | 功能相似 | TO-236 |
200mA 至 500mA，NXP Semiconductors 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流 ### 二极管和整流器，NXP Semiconductors NXP 以不同封装和配置提供广泛的开关二极管。
|
||
PMEG2005ET,215
|
Nexperia | 功能相似 | SOT-23-3 |
Nexperia 二极管 PMEG2005ET,215 肖特基, Io=500mA, Vrev=20V, 3引脚 SOT-23 (TO-236AB)封装
|
||
PMEG2005ET,215
|
NXP | 功能相似 | SOT-23-3 |
Nexperia 二极管 PMEG2005ET,215 肖特基, Io=500mA, Vrev=20V, 3引脚 SOT-23 (TO-236AB)封装
|
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