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Model PMEG2010EPA
Description 1A Up to 1.5A, NXP Semiconductors' efficient ultra small and thin surface mount packaging has been optimized for low forward voltage drop, high junction temperature, and negligible power switching loss with low leakage current in diodes and rectifiers. NXP Semiconductors NXP offers a wide range of switching diodes in different packages and configurations.
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Brand: NXP
Packaging SOD-323
Delivery time
Packaging method
Standard packaging quantity 1
0.75  yuan 0.75yuan
10+:
$ 1.0125
50+:
$ 0.9600
100+:
$ 0.9225
300+:
$ 0.9000
500+:
$ 0.8775
1000+:
$ 0.8550
2500+:
$ 0.8213
5000+:
$ 0.8138
Quantity
10+
50+
100+
300+
500+
Price
$1.0125
$0.9600
$0.9225
$0.9000
$0.8775
Price $ 1.0125 $ 0.9600 $ 0.9225 $ 0.9000 $ 0.8775
Start batch production 10+ 50+ 100+ 300+ 500+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(3421) Minimum order quantity(10)
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Technical parameters/Maximum forward surge current (Ifsm): 17 A

Technical parameters/forward voltage (Max): 375 mV

Technical parameters/forward current (Max): 1 A

Technical parameters/operating temperature (Max): 150 ℃

Technical parameters/operating temperature (Min): -55 ℃

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 3

Encapsulation parameters/Encapsulation: SOD-323

External dimensions/length: 2.1 mm

External dimensions/width: 2.1 mm

External dimensions/height: 0.65 mm

External dimensions/packaging: SOD-323

Other/Product Lifecycle: Unknown

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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