Technical parameters/minimum current amplification factor (hFE): 200
Technical parameters/operating temperature (Max): 150 ℃
Technical parameters/operating temperature (Min): -65 ℃
Technical parameters/dissipated power (Max): 300 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 6
Encapsulation parameters/Encapsulation: SOT-363
External dimensions/length: 2.2 mm
External dimensions/width: 1.35 mm
External dimensions/height: 1.1 mm
External dimensions/packaging: SOT-363
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Philips | 功能相似 |
Trans GP BJT PNP 45V 0.1A 300mW 6Pin TSSOP
|
|||
BCM857BS,115
|
NXP | 功能相似 | TSSOP-6 |
PNP/PNP 300 mW 45 V 100 mA 表面贴装 匹配对 晶体管 - TSSOP-6
|
||
PMP5201Y,115
|
NXP | 功能相似 | SOT-363 |
PMP5201Y 系列 45 V 100 mA 表面贴装 PNP/PNP 匹配 双 晶体管 - SOT-363
|
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