Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: MODULE
External dimensions/packaging: MODULE
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PMM4218TWP
|
Ericsson Microelectronics | 类似代替 | MODULE |
Module DC-DC 1Out 0.8V to 2.5V 60A 150W 20Pin
|
||
PMM4218TWP
|
Ericsson Power | 类似代替 |
Module DC-DC 1Out 0.8V to 2.5V 60A 150W 20Pin
|
|||
PTH04040WAD
|
TI | 功能相似 | DIP-20 |
Module DC-DC 3.3V/5Vin 1Out 0.8V to 2.5V 60A 150W 20Pin
|
||
PTH04040WAD
|
Artesyn Embedded Technologies | 功能相似 | MODULE |
Module DC-DC 3.3V/5Vin 1Out 0.8V to 2.5V 60A 150W 20Pin
|
||
PTH04040WAH
|
TI | 完全替代 | DIP-20 |
非隔离式DC/DC转换器 60A 3.3/5V-In Wide Output Adj Pwr Mdl
|
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