Technical parameters/frequency: 360 MHz
Technical parameters/RAM size: 405504 b
Technical parameters/number of logic gates: 4
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.71V ~ 3.465V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/packaging: BGA-256
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A001.a.7.a
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LFXP20C-3F256C
|
Lattice Semiconductor | 完全替代 | BGA-256 |
FPGA LatticeXP Family 20000 Cells 320MHz 130nm Technology 1.8V/2.5V/3.3V 256Pin FBGA Tray
|
||
LFXP20C-4F256C
|
Lattice Semiconductor | 完全替代 | BGA-256 |
FPGA LatticeXP Family 20000 Cells 360MHz 130nm Technology 1.8V/2.5V/3.3V 256Pin FBGA Tray
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review