Technical parameters/number of logic gates: 4
Technical parameters/power supply voltage: 1.71V ~ 3.465V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/packaging: BGA-256
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LFXP10C-3F256C
|
Lattice Semiconductor | 完全替代 | BGA-256 |
FPGA LatticeXP Family 10000 Cells 320MHz 130nm (CMOS) Technology 1.8V/2.5V/3.3V 256Pin FBGA Tray
|
||
LFXP10C-3FN256C
|
Lattice Semiconductor | 完全替代 | BGA-256 |
FPGA LatticeXP Family 10000 Cells 320MHz 130nm (CMOS) Technology 1.8V/2.5V/3.3V 256Pin FBGA Tray
|
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