Chip AI consultant
Package parameters/number of pins: 304
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/EU RoHS: Compliant
Other/Part Status: Obsolete
Other/HTS: 8542.31.00.01
Other/Standard Package Name: BGA
Other/Pin Count: 304
Other/Supplier Package: BGA
Other/Counting: Surface Mount
Other/Package Height: 1.73
Other/Package Length: 31
Other/Package Width: 31
Other/PCB changed: 304
Other/Lead Shape: Ball
Compliant with standards/RoHS standards: RoHS Compliant
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