Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX323CSA+
|
Maxim Integrated | 功能相似 | SOIC-8 |
模拟开关(双),Maxim Integrated Products ### 模拟开关,Maxim Integrated
|
||
MAX323ESA+T
|
Maxim Integrated | 功能相似 | SOIC-8 |
模拟开关, 2 放大器, SPST - 常开, 60 ohm, 2.7V 至 16V, NSOIC, 8 引脚
|
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