Encapsulation parameters/Encapsulation: TSOP1
External dimensions/packaging: TSOP1
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Mitsubishi | 功能相似 | TSOP1 |
CMOS 3.3V -ONLY闪存和CMOS静态RAM堆叠MCP CMOS 3.3V-ONLY FLASH MEMORY & CMOS STATIC RAM STACKED-MCP
|
||
M6MGT160S4BVP
|
Mitsubishi | 功能相似 | TSOP1 |
16777216位( 1,048,576 -word 16位/ 2097152 - WORD 8 - BIT) CMOS 3.3V -ONLY闪存 16,777,216-BIT (1,048,576 -WORD BY 16-BIT / 2,097,152-WORD BY 8-BIT) CMOS 3.3V-ONLY FLASH MEMORY
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