Technical parameters/tolerances: ±1 %
Technical parameters/digits: 16
Technical parameters/resistance: 4.7 kΩ
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: BGA-24
External dimensions/packaging: BGA-24
Physical parameters/operating temperature: -55℃ ~ 125℃
Physical parameters/temperature coefficient: ±200 ppm/℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: PCI,PCIX
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
RT2417B7TR7
|
CTS | 完全替代 | BGA-24 |
Res NET 4.7KΩ 1% 1W ±200ppm/℃ BUS Molded 24Pin BGA Ball SMD T/R
|
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