Technical parameters/Contact electroplating: Silver
Technical parameters/rated voltage (DC): 50.0 V
Technical parameters/rated current: 1.00 mA
Technical parameters/insulation resistance: 100 GΩ
Technical parameters/direction: Vertical
Technical parameters/contact type: SP3T
Technical parameters/number of pins: 3
Encapsulation parameters/installation method: Solder Lug, PC Board
Packaging parameters/pin spacing: 2.54 mm
External dimensions/length: 7.39 mm
External dimensions/width: 8.00 mm
External dimensions/height: 4.24 mm
External dimensions/pin spacing: 2.54 mm
Physical parameters/contact material: Gold
Physical parameters/shell material: Thermoplastic
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
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