Technical parameters/rated power: 0.1 W
Technical parameters/resistance: 150000 Ω
Technical parameters/resistance deviation: ±1 %
Technical parameters/operating temperature (Max): 155 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation (metric): 1608
Encapsulation parameters/Encapsulation: 0603
External dimensions/length: 1.6 mm
External dimensions/width: 0.8 mm
External dimensions/height: 0.45 mm
Dimensions/Packaging (Metric): 1608
External dimensions/packaging: 0603
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CR0603-FX-1503ELF
|
Bourns J.W. Miller | 功能相似 | 0603 |
BOURNS CR0603-FX-1503ELF. 厚膜片式电阻, 150Ω, ± 1%
|
||
MCR03EZPFX1503
|
ROHM Semiconductor | 功能相似 | 0603 |
0603 外壳 150 KOhms 1% 容差 100 PPM
|
||
RK73H1JTTD1503F
|
KOA | 类似代替 | 0603 |
Res Thick Film 0603 150KΩ 1% 0.1W(1/10W) 100ppm/℃ Molded SMD Punched Paper T/R
|
||
RK73H1JTTD1503F
|
KOA Speer | 类似代替 | 0603 |
Res Thick Film 0603 150KΩ 1% 0.1W(1/10W) 100ppm/℃ Molded SMD Punched Paper T/R
|
||
RK73H1JTTD1503F
|
Speer | 类似代替 | 0603 |
Res Thick Film 0603 150KΩ 1% 0.1W(1/10W) 100ppm/℃ Molded SMD Punched Paper T/R
|
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