Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SMA
External dimensions/packaging: SMA
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S1G-13-F
|
Diodes | 功能相似 | DO-214AC |
1.0A表面装载玻璃钝化整流 •适合自动放置•玻璃钝化结..
|
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S1G-13-F
|
Multicomp | 功能相似 | DO-214AC |
1.0A表面装载玻璃钝化整流 •适合自动放置•玻璃钝化结..
|
||
S1G-E3
|
Vishay Semiconductor | 完全替代 | DO-214AC |
VISHAY S1G-E3 Standard Recovery Diode, 400V, 1A, Single, 1.1V, 1.8µs, 40A
|
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VISHAY | 完全替代 |
VISHAY S1G-E3 Standard Recovery Diode, 400V, 1A, Single, 1.1V, 1.8µs, 40A
|
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S1G-E3/5AT
|
Vishay Dale | 功能相似 |
1A,高达 450V 采用工业标准封装类型的多用途、高效标准恢复功率二极管。 ### 二极管和整流器,Vishay Semiconductor
|
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