Technical parameters/power supply voltage: 2.7V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA-24
External dimensions/packaging: BGA-24
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL064LABBHI030
|
Cypress Semiconductor | 完全替代 | BGA-24 |
闪存, 浮动门架构, 串行NOR, 64 Mbit, 8M x 8位, SPI, BGA, 24 引脚
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review