Technical parameters/access time (Max): 8 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 40 ℃
Technical parameters/power supply voltage (Max): 3.6 V
Technical parameters/power supply voltage (Min): 2.7 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: BGA-24
External dimensions/packaging: BGA-24
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL512SAGBHIA10
|
Cypress Semiconductor | 类似代替 | BGA-24 |
闪存, MirrorBit Eclipse架构, 串行NOR, 512 Mbit, 64M x 8位, SPI, FBGA, 24 引脚
|
||
S25FL512SAGBHIA10
|
Spansion | 类似代替 | TBGA |
闪存, MirrorBit Eclipse架构, 串行NOR, 512 Mbit, 64M x 8位, SPI, FBGA, 24 引脚
|
||
S25FL512SAGBHIC10
|
Cypress Semiconductor | 类似代替 | BGA-24 |
FL-S 系列 512 M (64 M x 8) 3.6 V MirrorBit® 闪存 非易失性 存储器 - BGA-24
|
||
S25FL512SAGBHIC10
|
Spansion | 类似代替 | BGA-24 |
FL-S 系列 512 M (64 M x 8) 3.6 V MirrorBit® 闪存 非易失性 存储器 - BGA-24
|
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