Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: VFBGA
External dimensions/length: 8.15 mm
External dimensions/width: 6.15 mm
External dimensions/packaging: VFBGA
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29AS008J70BFI030
|
Spansion | 功能相似 | BGA |
NOR闪存 8Mb 3V 70ns Parallel NOR闪存
|
||
|
|
AMD | 功能相似 |
NOR闪存 8Mb 3V 70ns Parallel NOR闪存
|
|||
S29AS008J70BFI030
|
Cypress Semiconductor | 功能相似 | BGA-48 |
NOR闪存 8Mb 3V 70ns Parallel NOR闪存
|
||
|
|
Spansion | 功能相似 | VFBGA |
IC FLASH MEM 8Mbit 48FBGA
|
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