Technical parameters/digits: 16
Technical parameters/access time (Max): 100 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL01GS10TFI010
|
Spansion | 完全替代 | TSOP-56 |
GL-S 系列 1 Gb (64 M x 16) 3.6 V 100 ns 表面贴装 闪存 - TSOP-56
|
||
S29GL01GS10TFI020
|
Spansion | 完全替代 | TSOP-56 |
闪存, 或非, 并行NOR, 1 Gbit, 64M x 16位, 并行, TSOP, 56 引脚
|
||
S29GL01GS10TFI020
|
Cypress Semiconductor | 完全替代 | TSOP-56 |
闪存, 或非, 并行NOR, 1 Gbit, 64M x 16位, 并行, TSOP, 56 引脚
|
||
|
|
AMD | 功能相似 |
GL-S 系列 1G (64M x 16) 3.6 V MirrorBit® Eclipse™ 闪存 非易失性 存储器
|
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