Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LBGA
External dimensions/packaging: LBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL01GS11DHIV10
|
Cypress Semiconductor | 完全替代 | FBGA-64 |
闪存, 或非, 并行NOR, 1 Gbit, 64M x 16位, 并行, FBGA, 64 引脚
|
||
S29GL01GS11DHIV13
|
Cypress Semiconductor | 功能相似 | BGA |
NOR Flash Parallel 3V/3.3V 1G-bit 64M x 16 110ns 64Pin Fortified BGA T/R
|
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