Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LBGA
External dimensions/packaging: LBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
AMD | 完全替代 |
闪存, 并行NOR, 32 Mbit, 4M x 8位, 并行, BGA, 64 引脚
|
|||
S29GL032N90FFI020
|
Cypress Semiconductor | 完全替代 | BGA-64 |
闪存, 并行NOR, 32 Mbit, 4M x 8位, 并行, BGA, 64 引脚
|
||
S29GL032N90FFI042
|
Spansion | 完全替代 | BGA |
GL-N 系列 32 Mb (4 M x 8/2 M x 16) 3.6 V 页面模式 MirrorBit 闪存 -FBGA-64
|
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