Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL064A90TFIR62
|
Spansion | 功能相似 | TSSOP |
MirrorBit Flash Family
|
||
S29GL064A90TFIR70
|
Spansion | 功能相似 | TSSOP |
MirrorBit Flash Family
|
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