Technical parameters/power supply current: 110 mA
Technical parameters/access time (Max): 100 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL128P10FFI010
|
Spansion | 完全替代 | FBGA-64 |
S29GL128P 系列 128 Mb (16M x 8) 3 V 100 ns 闪存-NOR 存储器 - BGA-64
|
||
S29GL128P10FFI010
|
AMD | 完全替代 |
S29GL128P 系列 128 Mb (16M x 8) 3 V 100 ns 闪存-NOR 存储器 - BGA-64
|
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