Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL128S90FHI010
|
Cypress Semiconductor | 完全替代 | BGA-64 |
NOR Flash Parallel 3V/3.3V 128Mbit 8M x 16Bit 90ns 64Pin FBGA Tray
|
||
S29GL128S90FHI020
|
Cypress Semiconductor | 完全替代 | BGA-64 |
NOR Flash Parallel 3V/3.3V 128Mbit 8M x 16Bit 90ns 64Pin FBGA Tray
|
||
S29GL128S90FHI020
|
Spansion | 完全替代 | BGA-64 |
NOR Flash Parallel 3V/3.3V 128Mbit 8M x 16Bit 90ns 64Pin FBGA Tray
|
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