Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL512S11TFI023
|
Spansion | 功能相似 | TSSOP |
NOR Flash Parallel 3V/3.3V 512Mbit 32M x 16Bit 110ns 56Pin TSOP T/R
|
||
S29GL512S11TFIV13
|
Spansion | 功能相似 | TSSOP |
NOR Flash Parallel 3V 512Mbit 32M x 16Bit 110ns 56Pin TSOP T/R
|
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