Technical parameters/digits: 8, 16
Technical parameters/access time (Max): 90 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL256P90FFIR10
|
Spansion | 完全替代 | BGA |
闪存, MirrorBit架构, 并行NOR, 256 Mbit, 32M x 8位, CFI, 并行, FBGA, 64 引脚
|
||
S29GL256P90FFIR10
|
Cypress Semiconductor | 完全替代 | BGA |
闪存, MirrorBit架构, 并行NOR, 256 Mbit, 32M x 8位, CFI, 并行, FBGA, 64 引脚
|
||
S29GL256P90FFIR20
|
Spansion | 完全替代 | BGA-64 |
GL-P 系列 256 M (32 M x 8) 3.6 V 90 ns 表面贴装 闪存 - FBGA-64
|
||
S29GL256P90FFIR20
|
Cypress Semiconductor | 完全替代 | BGA-64 |
GL-P 系列 256 M (32 M x 8) 3.6 V 90 ns 表面贴装 闪存 - FBGA-64
|
||
|
|
Cypress Semiconductor | 完全替代 | BGA |
NOR Flash Parallel 3V/3.3V 256M-bit 32M x 8/16M x 16 90ns 64Pin Fortified BGA T/R
|
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