Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 400
Encapsulation parameters/Encapsulation: BBGA-400
External dimensions/packaging: BBGA-400
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Other/Manufacturing Applications: test equipment
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS3164
|
Maxim Integrated | 功能相似 | BBGA-400 |
单/双/三/四路ATM /分组PHY的DS3 / E3 / STS - 1 Single/Dual/Triple/Quad ATM/Packet PHYs for DS3/E3/STS-1
|
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