Chip AI consultant
Package parameters/number of pins: 156
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/EU RoHS: Supplier Unconfirmed
Other/Part Status: Obsolete
Other/Standard Package Name: BGA
Other/Pin Count: 156
Other/Supplier Package: LBGA
Other/Counting: Surface Mount
Other/Package Height: 1.05
Other/Package Length: 15
Other/Package Width: 15
Other/PCB changed: 156
Other/Lead Shape: Ball
Compliant with standards/RoHS standards:
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