Technical parameters/halogen-free state: Not Halogen Free
Technical parameters/RAM size: 26 Kb
Technical parameters/dissipated power: 1000 mW
Technical parameters/dissipated power (Max): 1000 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 272
Encapsulation parameters/Encapsulation: TEPBGA-272
External dimensions/packaging: TEPBGA-272
Physical parameters/operating temperature: -40℃ ~ 125℃
Other/Product Lifecycle: Not Recommended for New Designs
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
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