Technical parameters/number of contacts: 25
Technical parameters/rated current: 3 A
Technical parameters/number of pins: 25
Encapsulation parameters/installation method: Through Hole
External dimensions/height: 7.87 mm
Physical parameters/contact material: Copper Alloy
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MDM-25SCBR-A174
|
ITT Corporation | 类似代替 | Through Hole |
Conn Micro D-Subminiature SKT 25POS Solder RA Thru-Hole 25 Terminal 1Port
|
||
MDM-25SCBRP-A174
|
ITT Corporation | 类似代替 |
微-D印刷电路板 - .050触点间距 Micro-D PCB - .050 Contact Spacing
|
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