Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOT-23-3
External dimensions/width: 1.6 mm
External dimensions/packaging: SOT-23-3
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SI2307BDS-T1-GE3
|
Vishay Intertechnology | 类似代替 | SOT-23-3 |
Trans MOSFET P-CH 30V 2.5A 3Pin TO-236 T/R
|
||
SI2307BDS-T1-GE3
|
Vishay Semiconductor | 类似代替 | SOT-23-3 |
Trans MOSFET P-CH 30V 2.5A 3Pin TO-236 T/R
|
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