Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 40
Encapsulation parameters/Encapsulation: PowerPAK® MLP66-40
External dimensions/packaging: PowerPAK® MLP66-40
Physical parameters/operating temperature: -40℃ ~ 150℃ (TJ)
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SIC779CD-T1-GE3
|
Vishay Semiconductor | 功能相似 | PowerPAK |
SiC779 Series 5.5V 40A Integrated DrMOS Power Stage - PowerPAK® MLP66-40
|
||
SIC779CD-T1-GE3
|
Vishay Intertechnology | 功能相似 | MLP-66-40 |
SiC779 Series 5.5V 40A Integrated DrMOS Power Stage - PowerPAK® MLP66-40
|
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