Technical parameters/peak pulse power: 500 W
Technical parameters/minimum reverse breakdown voltage: 13.3 V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-16
External dimensions/packaging: SOIC-16
Physical parameters/operating temperature: -55℃ ~ 150℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: General
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SM1612/TR13
|
Microchip | 类似代替 |
Diode TVS Octal Uni-Dir 12V 300W 16Pin SOIC T/R
|
|||
SM1612/TR13
|
Microsemi | 类似代替 | SOIC-16 |
Diode TVS Octal Uni-Dir 12V 300W 16Pin SOIC T/R
|
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