Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN10KHT5574DW
|
TI | 功能相似 | SOIC-24 |
用D- TYPE边沿触发触发器和三态输出的八路ECL至TTL译者 OCTAL ECL-TO-TTL TRANSLATOR WITH D-TYPE EDGE-TRIGGERED FLIP-FLOPS AND 3-STATE OUTPUTS
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